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datashee t product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com 05.nov.2014 rev.001 8.0v to 35v, 3.0a/1.5a 1ch buck converter with integrated fet bd9873cp- v5 bd9874cp- v5 general description the bd9873cp-v5 and BD9874CP-V5 is a single-channel step-down switching regulator integrated with a p-channel mosfet. its circuitry eliminates t he need for external compensation and consisting only of a diode, a coil and a ceramic capacitor, reducing the board size significantly. features ? built-in p-channel fet ensures high efficiency ? output voltage adjustable via external resistors ? soft-start time : 4ms (fixed) ? built- in over-current and thermal shutdown protection circuits ? on/ off control via stby pin applications tvs, printers, dvd players, projectors, gaming devices, pcs, car audio/navigation systems, etcs, communication equipment, av products, office equipment, industrial devices, and more. key specifications ? input voltage r ang e: 8.0v to 35v ? output voltage range:1.0v to 0.8vx (v cc -i o ut xr on )v ? output current: bd9873cp-v5: 1.5a(max) BD9874CP-V5: 3.0a(max) ? switching frequency : 110khz(typ) ? p-channel fet on-resistance : bd9873cp-v5: 1.0 (typ) BD9874CP-V5: 0.5 (typ) ? standby current: 1 a(typ) ? operating temperature range: - 40 c to +8 5 c package w(typ) x d(typ) x h(max) typical application circuit figure 1. typical application circuit v cc stby out inv gnd c in c 2 d 1 l 1 c 1 r1 r2 v o ut v in c 3 to220cp- v5 10.00mm x 20.12mm x 4.60mm downloaded from: http:///
2/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 pin configuration figure 2. pin configuration pin descriptions block diagram pin no. pin name function 1 vcc input power supply pin 2 out internal p-channel fet drain pin 3 gnd ground 4 inv output voltage feedback pin 5 stby on/off control pin ss vref osc 1 2 driver pwm comp ctl logic tsd error amp 4 5 inv out gnd stby vcc ocp stby 3 figure 3. block diagram vcc out gnd inv stby top view 1 3 4 5 2 downloaded from: http:///
3/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 absolute maximum ratings (ta=25c) parameter symbol rating unit supply voltage (vcc-gnd) v cc 36 v stby-gnd v stby 36 v out-gnd v out 36 v inv-gnd v inv 5 v maximum switching current i out 1.5 (note 1) bd9873 a 3.0 (note 1) bd9874 a power dissipation pd 2 .0 0 (note 2) w operating temperature topr - 40 to +85 c storage temperature tstg - 55 t o +150 c (note 1) do not exceed pd, aso. (note 2) derated at 0. 16 w/ c over ta=25c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=- 40 c to +85c) parameter symbol limit unit min typ max input voltage v cc 8.0 - 35.0 v output voltage v o ut 1.0 - 0.8 x (v cc -i o ut x r on ) v electrical characteristics (unless otherwise noted, ta=25 c , v cc =12v, v o ut =5 v, v stby =3v) parameter symbol limit unit conditions min typ max output on -resistance r on - 1.0 1.5 bd9873 - 0.5 1.0 bd9874 efficiency 80 88 - i out 0.5a switching frequency f osc 99 110 121 khz load regulation v outload - 5 40 mv v cc =20v, i out =0.5a to 1.5a bd9873 - 5 40 mv v cc =20v, i out =1.0a to 3.0a bd9874 line regulation v outload - 5 25 mv v cc =10v to 30v, i out =1.0a over-current protection limit i o cp 1.6 - - a bd9873 3.2 - - a bd9874 inv pin threshold voltage v inv 0.985 1.00 1.015 v inv pin input current i inv - 1 2 a v inv =1.0v stby pin threshold voltage on v stbyon 2.0 - v cc v off v stbyoff -0.3 - +0.3 v stby pin input current i stby 5 15 30 a v stby =3v circuit current i cc - 5 12 ma v inv =2v stand-by current i st - 0 5 a v stby = 0v soft-start time t ss - 4 20 ms v stby =0 v to 3v downloaded from: http:///
4/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 typical performance curves bd9873cp- v5 figure 7.output voltage vs load current load current : i out [a] output voltage : v out [v] v cc =12v v cc =1 2v v cc =8v v cc =36v figure 4. efficiency vs load current efficiency : [%] load current : i out [a] figure 5 output voltage vs load current. (over current protection) output voltage : v out [v] load current : i out [a] v cc =12v figure 6 . switching frequency vs temperature switching frequency [khz] temperature : ta [c] downloaded from: http:///
5/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 typical performance curves C continued bd9873cp- v5 figure 10. delta output voltage vs output current v out - i out ? v out [v] output current : i o ut [a] v cc =12v figure 11. switching frequency vs supply voltage figure 9. circuit current vs supply voltage (i out =no load) supply voltage : v cc [v] circuit current : i cc [ma] v stb =3v supply voltage : v cc [v] switching frequency : f osc [khz] v out =5v figure 8. output voltage vs supply voltage supply voltage : v cc [v] v out =5v output voltage : v out [v] downloaded from: http:///
6/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 typical performance curves C continued bd9873cp- v5 typical waveforms bd9873cp- v5 figure 14. load response v out figure 12. inv pin threshold voltage vs temperature v cc =12v offset [v] temperature : ta [c] figure 13 . circuit current vs temperature i cc (stb) - ta temperature: ta [c] circuit current : i cc (stb) [a] figure 15. start-up waveform v out 2v / div 5v / div downloaded from: http:///
7/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 typical performance curves bd9874cp- v5 figure 19. output voltage vs load current output voltage: v out [v] load current : i out [a] v cc =12v figure 17. output voltage vs load current (over current protection) output voltage : v out [v] load current : i out [a] v cc =12v figure 16. efficiency vs load current v cc =8v v cc =12v v cc =36v efficiency [ %] load current : i out [a] figure 18 . switching frequency vs temperature switching frequency [khz] temperature : ta [c] downloaded from: http:///
8/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 typical performance curves C continued bd9874cp- v5 figure 20. output voltage vs supply voltage supply voltage : v cc [v] output voltage : v out [v] v out =5v figure 23. switching frequency vs supply voltage supply voltage : v cc [v] switching frequency : f osc [khz] v out =5v figure 21. circuit current vs supply voltage (i out =no load) supply voltage : v cc [v] circuit current : i cc [ma] v stb =3v figure 22 . delta outpu t voltage vs output current v out - i out output current : i out [a] ? v out [v] v cc =12v downloaded from: http:///
9/ 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 typical performance curves C continued bd9874cp- v5 typical waveforms bd9874cp- v5 figure 26. load response v out figure 27. start-up waveform v out figure 25. circuit current vs temperature (i cc (stb) C ta ) circuit current: i cc (stb) [a] temperature: ta [c] figure 24. inv pin threshold voltage vs temperature v cc =12v offset [v] temperature : ta [c] downloaded from: http:///
10 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 application information 1. block function explanation (1) vref generates a temperature-independent regulated voltage from the vcc input. (2) osc generates a triangular wave with an oscillation frequenc y of 11 0 khz or as set by the internal resistors and capacitors. the output of this block goes to the pwm comparator. (3) error amp detects the output voltage through a voltage divider network and compares it with an internal reference voltage. t he output of this block is the amplified difference between the detected output voltage and the reference. (4) pwm comp converts the error amp output to pwm pulses going to the driver block. (5) driver this push-pull fet driver accepts pwm input pulses from pwm comp block and drives the internal p-channel mosfet. (6) stby controls on/off operation using stby pin. the output is on when stby is high. (7) thermal shutdown (tsd) this circuit protects the ic against thermal runaway and damage due to excessive heat. a thermal sensor detect s the junction temperature and switches the output off once the temperature exceeds a threshold value (175deg). hysteresis is built in (15deg) in order to prevent malfunctions due to temperature fluctuations. (8) over-current protection (ocp) the ocp circuit detects the voltage difference between v cc and out by measuring the current through the internal p-channel mosfet and switches the output off once the voltage reaches the threshold value. the ocp block is a self-recovery type (not latch). (9) soft-start (s s) this block conducts soft start operations. when stby is high and the ic starts up the internal capacitor begins charging. the soft start time is set to 5ms. 2. notes for pcb layout (1) place capacitors between v cc and ground, and the schottky diode as close as possible to the ic to reduce noise and maximize efficiency. (2) connect resistors between inv and ground, and the output capacitor filter at the same ground potential in order to stabilize the output voltage. (if the patterning is long er or thin, its possible to cause ringing or waveform crack .) figure 28. layout 4 5 2 3 1 inv stby r 2 :1k r 1 :4k c 3 0.47 f vcc out gnd c 4 680f 5.0v l 1 100h d 1 c 2 4.7f c 1 100f downloaded from: http:///
11 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 3. application component selection and settings (1) inductor l 1 large inductor series impedance will result in deterioration of efficiency. ocp operation greater than 1.6a(bd9873) or 3.2a(bd9874) m ay cause inductor overheating, possibly leading to overload or output short. note that the current rating for the coil should be higher than l max out i i ?? ) ( . where: i out (max) is the maximum load current. if you allow current flow more than maximum current rating, the coil will overload , causing magnetic saturation, and those account for efficiency deterioration. select a coil with enough current rating which doesnt exceed peak current. where: l 1 is the inductor value. v cc is the maximum input voltage. v out is the output voltage. ? i l is the coil ripple current value. fosc is the oscillation frequency. (2) schottky barrier diode d 1 select a schottky diode having an inter-terminal capacity as small as possible (reverse recovery time as sho rt as possible) and a forward voltage v f as low as possible. (noise can be reduced and efficiency improved by reduction of switching noise and switching loss, as well as reduction of voltage drop loss of forward voltage.) diode should be selected on the basis of maximum current rating in forward direction, voltage rating in reverse direction, and power dissipation of diode. (a) the maximum current rating is higher than the combined maximum load current and coil ripple current ( ? i l ). (b) the reverse voltage rating is higher than the in value. (c) recommend using a diode with smaller the reverse current as possible in the high temperature case, the reverse current is increasing and it may cause overdrive (d) power dissipation for the selected diode must be within the rated level. the power dissipation of the diode is expressed by the following formula: where: i out (max) is the maximum load current. v f is the forward voltage. v out is the output voltage. v cc is the input voltage. (3) ou tput capacitor c 4 a suitable output capacitor should satisfy the following formula for esr: another factor that must be considered is the permissible ripple current. select a capacitor with sufficient margin, governed by the following formula: where: i rms is the effective value of ripple current to the output capacitor ? i l is the coil ripple current the output capacitor is a major factor for system stability. when an inappropriate capacitor is selected, expected characteristics may not be guaranteed depending on ambient temperature, output voltage setting condition, etc. fully confirm esr, temperature characteristics, dc, and bias characteristics before evaluation. ? ? osc cc out out cc l f v v l v v i 1 1 ? ? ? ? ? where: ? v l is the permissible ripple voltage. ? i l is the coil ripple current. ) / 1( ) ( cc out f max out v v v i pdi ? ? ? ? l l i v esr ? ?? / 32/ l rms i i ?? downloaded from: http:///
12 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 (4) intput capacitor c 1 ,c 2 the input capacitor is the source of current flow to the coil via the built-in p-channel fet when the fet is on. when selecting the input capacitor, sufficient margin must be provided to accommodate capacitor voltage and permissible ripple current. the expression below defines the effective value of the ripple current to the input capacitor. it shoul d be used in determining the suitability of the capacitor in providing sufficient margin for the permissible ripple current. where: i rms is the effective value of the ripple current to the input capacitor. i out is the output load current. v out is the output voltage. v cc is the input voltage. (5) capacitor,c 3 this capacitor is utilized to stabilize the frequency characteristics. when c 3 is removed, overshoot or undershoot may occur during start-up or in rapid change of load. be sure to insert 0.47 f. (6) resistor r 1, r 2 these resistors determine the output voltage: select resistors less than 10k ? . bd9873cp- v5 inductor l 1 = 100h : rcr16 16 (sumida) schottky diode d 1 = rb050la- 40 (rohm) capacitor c 1 = 100f : al electrolytic capacitor c 2 = 4.7f : laminated ceramic capacitor c 3 = 0.47f : laminated ceramic capacitor c 4 = 680f : al electrolytic capacitor bd9874cp- v5 inductor l 1 =100h : rcr1616 (sumida) schottky diode d 1 =rb050la- 40 (rohm) capacitor c 1 = 100f : al electrolytic capacitor c 2 = 4.7f :laminated ceramic capacitor c 3 = 0.47f :laminated ceramic capacitor c 4 = 680f : al electrolytic capacitor ? ? cc out cc out out rms v v v v i i / / 1 ? ? ? ? ) / 1( 0.1 2 1 r r v v out ? ? ? downloaded from: http:///
13 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 4. tj (tip junction temperature) calculating method it is impossible to measure the tip junction temperature tj outside the ic, but it can be calculated by the formula shown below. calculation method of tip junction temperature tj ? ? tc c j w tj ? ? ? ? ? where: w is the power consumed by ic (calculated by the formula below) j - c is the thermal resistance from the tip to the back of the package 12.5 c/w for to220 package tc is the ic surface temperature (to be measured by thermocouple, etc.) calculation method of electric power w consumed by ic where: v in is the input voltage i in is the input voltage v out is the output voltage i out is the load current v f is the forward voltage of schottky diode ? ? in out out f out out in in v v i v i v i v w / 1 ? ? ? ? ? ? ? ? downloaded from: http:///
14 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 power dissipation i/o equivalent circuit 1pin,fin (v cc , gnd) 2pin (out) 4pin (inv) 5pin (stby) figure 30. in put output equivalent circuit (1) no heat sink (2) aluminum heat sink 50 x 50 x 2 ( mm 3 ) (3) aluminum heat sink 100 x 100 x 2 ( mm 3 ) figure 29. power dissipation ambient temperature : ta[c] 0 5 10 15 0 25 50 75 100 125 150 (3) 11.0w (2) 6.5w (1) 2.0w power dissipation : pd [w] ambient temperature : ta [c] power dissipation : pd [w] out vcc v cc vcc gnd vcc inv vcc v cc stby vcc v cc downloaded from: http:///
15 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 operational notes 1. reverse connection of power s upply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity whe n connecting the power supply, such as mounting an external diode between the power supply and th e ic s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the an alog block. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guarantee d under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush curre nt may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge ca pacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environme nt) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
16 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge i t. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, crea ting a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p s ubstrate) should be avoided. figure 31. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should alwa ys be within the ics power dissipation rating. if however the rating is exceeded for a continued perio d, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the t j falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
17 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 ordering information b d 9 8 7 x c p - v 5 - e 2 part number 9873 9874 package cp - v5 : to220cp- v5 packaging and forming specification e2: embossed tape and reel lineup maximum output current (max) part number marking package orderable part number 1.5 a bd9873 cp to220cp- v5 reel of 5 00 bd9873cp-v5e2 3.0 a bd9874 cp to220cp- v5 reel of 5 00 BD9874CP-V5e2 marking diagram to220cp- v5 (top view) part number marking lot number downloaded from: http:///
18 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 physical dimension, tape and reel information package name to220cp- v5 downloaded from: http:///
19 / 19 tsz02201-0q3q0aj00440-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd9873cp-v5 bd9874cp- v5 05.nov.2014 rev.001 revision history date revision changes 05.nov.2014 001 new release downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific app lications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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